Electric Component Comprising External Electrodes and Method for the Production of an Electric Component Comprising External Electrodes

ABSTRACT

An electrical component includes a ceramic base body that includes a surface that is partially ceramic, electrodes in the ceramic base body that have ends that form parts of the surface of the ceramic base body, and a bonding layer on the surface of the ceramic base body. The bonding layer has a composition such that, when the bonding layer is heated, the bonding layer is less adhesive to the ends of the electrodes than when not heated.

The invention relates to an electrical component, especially an NTCcomponent, and also to its fabrication.

Conventional electroceramic components normally have contact bodies onthe surface of the ceramic base body which are used for makingelectrical contacts to the components and which, among other things,guarantee the SMD (surface mounted device) capability of the component.These electrically conductive contact bodies or terminations are usuallycomposed of a material that is different from that of the ceramic basebody, with the result that problems arise concerning the adhesion of thecontact bodies to the base body.

From U.S. Pat. No. 5,245,309, ceramic NTC components are known in whichthe ceramic base body is fabricated using multilayer technology and iscomposed of ceramic layers with internal electrodes arranged in theselayers. These internal electrodes each contact an outer contact body andform an electrode terminal. Furthermore, an outer passivation layer,e.g., glass, can be applied on the surface of the component. With thistechnology, it is possible to realize different electrical resistancesby varying the arrangement of the internal electrodes for componentswith the same component standard.

From DE 10159451 A1, an NTC component with a base body is known, whichis composed of at least a first and a second spatially formed ceramicarea part made from different NTC materials, wherein at least one firstand one second contact layer are provided on the surface of the basebody. Likewise, by varying both the relative arrangement and therelative portions of the two ceramic area parts in the base body andalso through suitable material combinations for equal dimensions of thebase body, NTC components with different electrical characteristics arefabricated.

From DE 4207915, it is known that the resistance value of a thermistorelement can be changed by varying the distance between the ends of theinternal electrodes. In this way, the production low-resistance NTCcomponents that are particularly thin, and therefore susceptible todamage through fractures or cracks, can be avoided.

At the base of the present invention lies the problem of proposing anelectrical component resistant to aggressive environmental conditions.

The problem is solved in terms of an electrical component and in termsof its fabrication by the features of the respective independent claim.

Advantageous embodiments of the invention follow from the dependentclaims.

An electrical component is proposed, comprising:

-   -   a ceramic base body with a partially ceramic surface,    -   a plurality of electrodes arranged in the ceramic base body, the        ends of the electrodes forming a part of the surface of the base        body, wherein

the surface of the base body is provided with a bonding layer having acomposition selected such that its bonding strength decreases whenheated at the ends of the electrodes.

According to one embodiment of the invention, the electrical componenthas at least one electrical contact body applied to the surface of thebase body and connected to the ends of the electrodes in an electricallyconductive way. Here, the surface of the base body is provided with abonding layer for at least partial connection of the contact body to theceramic part of the surface of the base body.

An electrical component constructed in this way has the advantage thatthe bonding layer is run off/purged by itself when it is heated by theelectrode ends and the area exposed in this way allows contacts to bemade with the contact bodies to the electrode ends. This is done withouta bonding layer remaining between the electrode ends and the contactbody to a significant extent that changes the resistance value of theelectrical component.

Thus, advantageously, the maximum surface area of the ceramic surface ofthe base body is used for bonding with the contact body. Simultaneously,the ceramic base body is provided with a bonding layer that protectsagainst aggressive environmental conditions in the area where thecontact body is not arranged on the substrate.

The contact bodies can as a matter of course also be realized as contactlayers or also as ends of contact wires that create a connection to anexternal current and voltage source.

Advantageously, the contact bodies are connected to the ceramic areas ofthe ceramic surface due to the special characteristic of the bondinglayer, even though at the same time they are through-contacted with theelectrode ends arranged in the same area.

Another advantage is to be seen in that the contact bodies bond morestrongly with the ceramic substrate and therefore exhibit a highpull-off resistance.

Until now, during a thermal fixing phase, the contact bodies could onlybe burned in on the ceramic substrate with simultaneous and considerablechange to the basic resistance value of the electrical component. Withone of the electrical components proposed here, it is particularlyfavorable that the effect of the burning in of the contact bodies on theresistance value of the electrical component is reduced by the coatingof the ceramic substrate. This is because bonding and decoupling layersno longer have to be bonded to the electrode ends and thethrough-contact of the electrodes to the contact body is particularlyclean. In addition, the ceramic substrate is electrically insulated fromthe contact bodies so that a reduced change in the basic resistancevalue of the electrical component can also be achieved here. For thispurpose, it is preferred that the bonding layer is electricallyinsulating and is thus also a decoupling layer.

Preferably, the reduced adhesion of the bonding layer to the ends of theelectrodes lies in a temperature range between 50 to 200 K below theburn-in temperature of the contact body. This results in the advantagethat during the burn-in of the contact body on the ceramic substrate,sufficient softening of the bonding layer takes place so that thebonding layer is by itself purgeable/runs off from the ends of theelectrodes. For this purpose, the bonding layer preferably comprises alead-borosilicate mixture so that it is thoroughly purgeable from theends of the electrodes during softening.

For fabricating an electrical component, a method is proposed in which

-   -   a ceramic base body is generated with a partially ceramic        surface, wherein a plurality of electrodes are formed in its        interior in such a manner that the ends of the electrodes form a        part of the surface,    -   the surface of the base body is wetted with a bonding layer that        bonds poorly to the ends of the electrodes at a given        temperature.

Poor bonding is also understood to mean that the bonding layer no longeradheres to the ends of the electrodes in the heated state.

The fabrication process is preferably extended in such a manner that acontact body is applied to the base body, whereby the electricalcomponent is heated during a thermal fixing phase so that the bondinglayer is run off/purged from the parts of the surface of the base bodyformed with electrodes and a through-contact of the contact body to theends of the electrodes is achieved.

The term “thermal fixing phase” is understood to be a thermal phase inwhich the contact bodies are burned in on the ceramic base body—theburn-in of the contact bodies is thus a part of the thermal fixingphase.

The invention is explained in more detail with reference to thefollowing embodiments and figures, wherein:

FIGS. 1 and 2 show a longitudinal view and cross-sectional view,respectively, of a preferred embodiment of an electrical NTC component,

FIG. 3 shows the behavior of three ceramic base bodies with or without abonding and decoupling layer in certain fabrication steps at differenttemperatures.

FIG. 1 shows how a ceramic base body 2, which preferably comprises amanganese-nickel oxide mixture, is provided with electrodes 3 arrangedin parallel. Each of these electrodes extends to the surface with oneend 6 and thus forms a part of the surface. Simultaneously, a bondingand decoupling layer 5 is applied to the ceramic base body.

The electrodes preferably comprise a silver-palladium (Ag—Pd) alloy. Thecontact bodies comprise a base metallization made from silver (Ag) thatpreferably is reinforced galvanically with a nickel and a tin layer.

Such an electrical NTC component is preferably fabricated in thefollowing way: a glass layer 5 is applied to the sintered ceramic basebody 2. This is performed preferably by a method for depositing thinlayers, e.g., through immersion in a glass slurry, spraying of a glassslurry and subsequent or accompanying drying. The glass slurry isadvantageously provided with a bonding agent, thereby improving theadhesion of the dried layer. Typical layer thicknesses, dried green, liein the range between 1 and 20 μm. An exemplary glass slurry consists of100 g of glass powder, 3-20 g of bonding agent and 500-1000 g of water.As a bonding agent, cellulose derivatives, for example carboxymethylcellulose, hydroxypropylmethyl cellulose, polyvinyl alcohol,polyethylene glycol and silicone resins may be used.

The composition of the glass is tailored to the wetting in particular ofthe ceramic body, i.e., the ceramic surface of the ceramic substrate. Atypical composition of the glass can stem from the systems B—Si(borosilicate), in particular lead-borosilicate (Pb—B—Si), or Zn—B—Si(tin borosilicate), optionally with other additives, for example Ba, Al,Cu, Fe, Cr, Mg. The coated ceramic base body 2 obtained in this way isnow provided with the contact bodies or the terminations 4 in a knownway through immersion and drying. After the contact bodies are appliedto the ceramic substrate for the first time with this step, the bondinglayer already bonds to the surface of the contact body since its surfacecomprises a surface composition resulting in the bonding layerpenetrating between the particles of the contact body surface.

A permanent bond between the contact body and the bonding layer istherefore also guaranteed in the later thermal fixing phase. The thermalfixing, typically in the range between 650° C. and 850° C., followsthereafter.

The glass is selected so that its softening point lies ca. 50-200 Kbelow the burn-in temperature of the contact body or the termination. Inthis thermal fixing phase, the bonding layer is heated to a temperatureat which it begins to soften and is finally run-off/purged from the endsof the electrodes. Thus, the bonding layer remains bonded to the ceramicsurface of the ceramic base body but not to the ends of the electrodes,thereby allowing the formation of a through-contact from the terminationor the contact body to the ends of the electrodes. The through-contactsof the contact bodies to the electrode ends are realized since thecontact body partially softens during the thermal fixing phase and thusflows onto the electrode ends. This liquefied contact body material maythen harden and thus forms a solid electrical contact to the electrodes.

The composition of the bonding layer is to be selected such that thegeneral interaction between the glass and the electrode material isconsidered insofar as the removal of the softened glass layer in thethermal fixing phase is simplified. In general, care is to be taken thatthe electrode ends are composed of a different material than the contactbodies to the extent that the bonding layer forms a significantly poorerbond to the electrode ends than to the contact bodies.

Due to the running off/purging of the bonding layer from the electrodeends during the thermal fixing phase, the previously common processingstep in which the bonding layer parts still bonded to the ends of theelectrodes must be ablated, is eliminated. As a matter of course, thethickness of the bonding layer applied to the surface of the ceramicsubstrate is selected so that a complete softening of the bonding layerat the ends of the electrodes can be achieved during the thermal fixingphase.

The bonding layer remaining between the contact bodies and the ceramicsurface of the ceramic base body produces a reinforced pull-offresistance of the contact body, so that a pull-off resistance of thecontact body of up to 50 N can be achieved. In contrast, referencecomponents without a bonding layer between the contact bodies and theceramic surface can have a defect percentage of typically 10-20% duringa peel-off test, while the component proposed according to the inventionpasses this test with 100%.

The change in the basic resistance value of the electrical componentthrough the burning-in of the contact body can be reduced from ca. 12%to below 4% with an electrical component according to the invention. Thechange in the resistance of the ceramic base body during the galvanicreinforcement of the contact body, caused by the ceramic removal at theexposed surface of the ceramic substrate in acid galvanic baths, isreduced from 2% to below 0.5% (see FIG. 3). In the case of NTCcomponents on basis of spinel, the sensitivity of the resistance valueof the ceramic component vis-à-vis the burning in of terminations on theceramic base body is reduced in particular by means of the bonding anddecoupling layer.

It is preferred that the ceramic base body is fabricated using knownmultilayer technology.

The bonding layer applied to the areas of the base body not lyingbetween the contact body and the base body is used as a protective layerthat is resistant to aggressive environmental conditions in otherprocessing steps, for example during the galvanic reinforcement of thetermination with nickel-tin layers or during the onset of flux materialduring soldering.

FIG. 2 shows a view of the electrical component 1 in the direction ofthe arrow shown in FIG. 1. The area 8 free of the bonding layer is shownschematically around one electrode end 6. The contact body 4, which liesin this perspective between the viewer of the electrical component andthe ceramic base body, is not drawn in order that the cross section ofthe electrical component may be freely visible.

FIG. 3 shows the change in the resistance value ΔW of three ceramic basebodies with or without a bonding or coupling layer in certainfabrication steps at different temperatures.

The left group of bars shows the case when the ceramic base body isprovided with a bonding layer according to the invention, whereby:

1. The left bar B1 shows a small change in the resistance value ΔW₁ ofthe ceramic base body in a period of 10 min before and after thegalvanic reinforcement of the termination at 25° C.

2. The central bar B2 shows a minor change in the resistance value ofthe base body in a period of 10 min before and after the galvanicreinforcement of the termination at temperatures between 25 and 100° C.

3. The right bar B3 shows the negative change in the resistance value ofthe ceramic base body during the thermal fixing phase.

The central group of bars shows the case when the ceramic base body isalso provided with a bonding layer according to the invention; this timewith a thicker layer deposit, whereby a waiting time of 20 min after theabove delineated time points 1 to 3, until the resistance value ismeasured, was included here. As in the left group of bars, a highstability of the resistance value of the ceramic base body is also to beseen here.

The right group of bars shows the reference case in which there is nobonding and decoupling layer according to the state of the art betweenthe contact body or the termination and the ceramic substrate. In thiscase, the changes in the resistance values of the ceramic substrate inthe above delineated cases 1 to 3 are much higher.

LIST OF REFERENCE SYMBOLS

-   1 Electrical component-   2 Ceramic base body-   3 Electrodes-   4 Termination-   5 Bonding layer-   6 Electrode ends-   7 Ceramic surface-   8 Area free of the bonding layer-   B1 First bar of change in resistance value-   B2 Second bar of change in resistance value-   B3 Third bar of change in resistance value

TECHNICAL FIELD

This patent application relates to an electrical component, such as anNTC component, and also to fabrication of the electrical component.

BACKGROUND

An electroceramic component includes electrically conductive contactbodies on a ceramic base body surface, which are used for makingelectrical contacts and which, among other things, enable SMD (surfacemounted device) mounting. These electrically conductive contact bodies,or terminations, are usually comprised of a material that is differentfrom that of the ceramic base body. As a result, problems arise withadhering the contact bodies to the base body.

U.S. Pat. No. 5,245,309 describes a ceramic NTC component in which aceramic base body is fabricated using multilayer technology and iscomprised of ceramic layers with internal electrodes arranged in theselayers. These internal electrodes each contact an outer contact body andform an electrode terminal. Furthermore, an outer passivation layer,e.g., glass, can be applied on a surface of the component. With thistechnology, it is possible to obtain different electrical resistances byvarying the arrangement of the internal electrodes for components with asame component standard.

DE 10159451 A1 describes an NTC component with a base body, which iscomprised of at least first and second spatially formed ceramic areaparts made from different NTC materials. At least one first and onesecond contact layer are on a surface of the base body. It is possibleto fabricate NTC components with different electrical characteristics byvarying both the arrangement and the relative portions of the twoceramic area parts in the base body, and also by varying materialcombinations without changing the dimensions of the base body.

DE 4207915 describes that a resistance value of a thermistor element canbe changed by varying a distance between ends of its internalelectrodes. In this way, it is possible to avoid production oflow-resistance NTC components that are particularly thin, and thereforesusceptible to damage through fractures or cracks.

SUMMARY

Described herein is an electrical component that comprises a ceramicbase body with a partially ceramic surface, and a plurality ofelectrodes arranged in the ceramic base body. The ends of the electrodesform a part of the surface of the base body. The surface of the basebody includes a bonding layer having a composition with a bondingstrength that decreases when heated at ends of the electrodes.

According to one embodiment, the electrical component has at least oneelectrical contact body applied to a surface of the base body andconnected to ends of the electrodes in an electrically conductive way.The surface of the base body includes a bonding layer for at leastpartly connecting the contact body to the ceramic part of the surface ofthe base body.

In the foregoing electrical component, only the bonding layer is runoff/purged when it is heated by the electrode ends. The resultingexposed area allows contacts to be made between the contact bodies andthe electrode ends. This is done without a bonding layer remainingbetween the electrode ends and the contact body which, to a significantextent, changes the resistance value of the electrical component.

Thus a maximum surface area of the ceramic surface of the base body canbe used for bonding with the contact body. The ceramic base body alsoincludes a bonding layer that protects against adverse environmentalconditions in an area where the contact body is not on the substrate.

The contact bodies can be implemented as contact layers or as ends ofcontact wires that create a connection to an external current andvoltage source.

Advantageously, the contact bodies are connected to ceramic areas of theceramic surface due to a special characteristic of the bonding layer,even though they are also through-contacted with electrode ends arrangedin the same area.

Another advantage is that the contact bodies bond more strongly with theceramic substrate and, therefore, have a high pull-off resistance.

Heretofore, during a thermal fixing phase, contact bodies could only beburned in on the ceramic substrate with simultaneous and considerablechange to the basic resistance value of the electrical component. In theelectrical components described herein, an effect of burning-in thecontact bodies on resistance value of the electrical component isreduced by virtue of the coating on the ceramic substrate. This isbecause bonding and decoupling layers no longer have to be bonded to theelectrode ends and the through-contact of the electrodes to the contactbody is particularly clean. In addition, the ceramic substrate iselectrically insulated from the contact bodies so that a reduced changein the basic resistance value of the electrical component can also beachieved. For this purpose, the bonding layer is electrically insulatingand is thus also a decoupling layer.

The reduced adhesion of the bonding layer to the ends of the electrodesmay be in a temperature range between 50 to 200 K below the burn-intemperature of the contact body. As a result, during burn-in of thecontact body on the ceramic substrate, sufficient softening of thebonding layer takes place so that only the bonding layer ispurgeable/runs off from the ends of the electrodes. The bonding layermay comprise a lead-borosilicate mixture so that it is thoroughlypurgeable from the ends of the electrodes during softening.

Also described herein is a method for fabricating an electricalcomponent. According to the method, a ceramic base body is generatedwith a partially ceramic surface. A plurality of electrodes are formedin an interior of the ceramic base body in such a manner that the endsof the electrodes form a part of the surface. The surface of the basebody is wetted with a bonding layer that bonds poorly to the ends of theelectrodes at a given temperature. Poor bonding is understood to meanthat the bonding layer no longer adheres to the ends of the electrodeswhen heated.

The fabrication process may be extended so that a contact body isapplied to the base body. The electrical component is heated during athermal fixing phase so that the bonding layer is run off/purged fromthe parts of the surface of the base body formed with electrodes, and athrough-contact of the contact body to the ends of the electrodes isformed.

The term “thermal fixing phase” is understood to be a thermal phase inwhich the contact bodies are burned-in on the ceramic base body—theburn-in of the contact bodies is thus a part of the thermal fixingphase.

Embodiments are explained in more detail with reference to the followingfigures.

DESCRIPTION OF THE DRAWINGS

FIGS. 1 and 2 show a longitudinal view and cross-sectional view,respectively, of an embodiment of an electrical NTC component, and

FIG. 3 shows the behavior of three ceramic base bodies with or without abonding and decoupling layer in certain fabrication steps at differenttemperatures.

DETAILED DESCRIPTION

FIG. 1 shows a ceramic base body 2, which may comprise amanganese-nickel oxide mixture. Electrodes 3 are arranged in parallel inceramic base body 2. Each of these electrodes extends to the surfacewith one end 6 and thus forms a part of the surface of ceramic base body2. Simultaneously, a bonding and decoupling layer 5 is applied to theceramic base body.

The electrodes may comprise a silver-palladium (Ag—Pd) alloy. Thecontact bodies comprise a base metallization made from silver (Ag) thatmay be reinforced galvanically with a nickel and a tin layer.

An electrical NTC component such as that of FIG. 1 may be fabricated inthe following way: a glass layer 5 is applied to the sintered ceramicbase body 2. This may be done via a method for depositing thin layers,e.g., through immersion in a glass slurry, spraying of a glass slurry,and subsequent or accompanying drying. The glass slurry may include abonding agent, which improves adhesion of the resulting dried layer.Typical layer thicknesses, dried green, are in a range between 1 and 20μm. An exemplary glass slurry includes 100 g of glass powder, 3-20 g ofbonding agent, and 500-1000 g of water. As a bonding agent, thefollowing may be used: cellulose derivatives, carboxymethyl cellulose,hydroxypropylmethyl cellulose, polyvinyl alcohol, polyethylene glycol,and silicone resins.

The composition of the glass is tailored to the wetting of the ceramicbody, i.e., the ceramic surface of the ceramic substrate. A typicalcomposition of the glass can stem from the systems B—Si (borosilicate),in particular, lead-borosilicate (Pb—B—Si), or Zn—B—Si (tinborosilicate), optionally with other additives, for example Ba, Al, Cu,Fe, Cr, Mg. The coated ceramic base body 2 obtained in this way includescontact bodies or terminations 4 obtained through immersion and drying.After the contact bodies are applied to the ceramic substrate for thefirst time, the bonding layer bonds to the surface of the contact body,since its surface has a composition that causes the bonding layer topenetrate between particles of the contact body surface. A permanentbond between the contact body and the bonding layer is, therefore, alsoguaranteed in the later thermal fixing phase. Thermal fixing, typicallyin the range between 650° C. and 850° C., follows thereafter.

The glass is such that its softening point is ca. 50-200 K below theburn-in temperature of the contact body or the termination. In thisthermal fixing phase, the bonding layer is heated to a temperature atwhich it begins to soften and is finally run-off/purged from the ends ofthe electrodes. Thus, the bonding layer remains bonded to the ceramicsurface of the ceramic base body, but not to the ends of the electrodes,thereby enabling formation of a through-contact from the termination orthe contact body to the ends of the electrodes. The through-contacts ofthe contact bodies to the electrode ends are obtained, since the contactbody partially softens during the thermal fixing phase and thus flowsonto the electrode ends. This liquefied contact body material may thenharden and thus forms a solid electrical contact to the electrodes.

The composition of the bonding layer is such that the generalinteraction between the glass and the electrode material is consideredinsofar as removal of the softened glass layer in the thermal fixingphase is simplified. In general, care is to be taken that the electrodeends are comprised of a different material than the contact bodies tothe extent that the bonding layer forms a significantly poorer bond tothe electrode ends than to the contact bodies.

Due to the running off/purging of the bonding layer from the electrodeends during the thermal fixing phase, the previously common processingstep in which the bonding layer parts still bonded to the ends of theelectrodes must be ablated, is eliminated. The thickness of the bondinglayer applied to the surface of the ceramic substrate is such that acomplete softening of the bonding layer at the ends of the electrodescan be achieved during the thermal fixing phase.

The bonding layer remaining between the contact bodies and the ceramicsurface of the ceramic base body produces a reinforced pull-offresistance of the contact body, resulting in a pull-off resistance ofthe contact body of up to 50 N. In contrast, reference componentswithout a bonding layer between the contact bodies and the ceramicsurface can have a defect percentage of typically 10-20% during apeel-off test. The component described herein passes this test with100%.

The change in the basic resistance value of the electrical componentthrough the burning-in of the contact body can be reduced from ca. 12%to below 4%. The change in the resistance of the ceramic base bodyduring galvanic reinforcement of the contact body, caused by ceramicremoval at the exposed surface of the ceramic substrate in acid galvanicbaths, is reduced from 2% to below 0.5% (see FIG. 3). In the case of NTCcomponents on basis of spinel, the sensitivity of the resistance valueof the ceramic component vis-à-vis the burning-in of terminations on theceramic base body is reduced by the bonding and decoupling layer.

The ceramic base body may be fabricated using known multilayertechnology.

The bonding layer applied to the areas of the base body that are notbetween the contact body and the base body is used as a protective layerthat is resistant to adverse environmental conditions in otherprocessing steps, for example, during galvanic reinforcement of thetermination with nickel-tin layers or during onset of flux materialduring soldering.

FIG. 2 shows a view of the electrical component 1 in the direction ofthe arrow shown in FIG. 1. The area 8 free of the bonding layer is shownschematically around one electrode end 6. The contact body 4, which is,in this perspective, between the viewer of the electrical component andthe ceramic base body, is not drawn in order that the cross section ofthe electrical component is visible.

FIG. 3 shows the change in the resistance value, ΔW, of three ceramicbase bodies with or without a bonding or coupling layer in certainfabrication steps at different temperatures.

The left group of bars shows the case when the ceramic base body has abonding layer. More specifically:

1. The left bar B1 shows a small change in the resistance value, ΔW₁, ofthe ceramic base body in a period of 10 min before and after thegalvanic reinforcement of the termination at 25° C.

2. The central bar B2 shows a minor change in the resistance value ofthe base body in a period of 10 min before and after the galvanicreinforcement of the termination at temperatures between 25 and 100° C.

3. The right bar B3 shows the negative change in the resistance value ofthe ceramic base body during the thermal fixing phase.

The central group of bars shows the case when the ceramic base body hasa bonding layer; this time with a thicker layer deposit, which includesa waiting time of 20 min after the above time points 1 to 3, until theresistance value is measured. As in the left group of bars, a highstability of the resistance value of the ceramic base body is alsoshown.

The right group of bars shows the reference case in which there is nobonding and decoupling layer according to the state of the art betweenthe contact body or the termination and the ceramic substrate. In thiscase, the changes in the resistance values of the ceramic substrate inthe above cases 1 to 3 are much higher.

1. An electrical component comprising: a ceramic base body withcomprising a surface that is partially ceramic; electrodes in theceramic base body, the electrodes having ends that form parts of thesurface of the ceramic base body; and a bonding layer on the surface ofthe ceramic base body, the bonding layer having a composition such that,when the bonding layer is heated, the bonding layer is less adhesive tothe ends of the electrodes than when not heated.
 2. The electricalcomponent of claim 1, further comprising: at least one electricalcontact body adjacent to the surface of the ceramic base body andelectrically connected to at least some of the ends of the electrodes.3. The electrical component of claim 1, wherein the bonding layer iselectrically insulating.
 4. The electrical component of claim 1, whereinthe bonding layer comprises a protective layer to protect the ceramicbase body from adverse environmental conditions.
 5. The electricalcomponent of claim 1, wherein the bonding layer comprises a borosilicateglass mixture.
 6. The electrical component of claim 1, wherein theceramic base body comprises a manganese-nickel oxide mixture.
 7. Theelectrical component of claim 2, wherein reduced adhesion of the bondinglayer to the ends of the electrodes occurs in a temperature rangebetween 50° K and 200° K below a burn-in temperature of the at least oneelectrical contact body.
 8. The electrical component of claim 1, whereinthe bonding layer comprises a lead-borosilicate (Pb—B—Si) mixture. 9.The electrical component of claim 1, wherein the bonding layer comprisesone or more of the following materials: Ba, Al, Cu, Fe, Cr, and Mg. 10.The electrical component of claim 1, wherein a composition of thebonding layer is such that the bonding layer adheres to ceramic parts ofthe surface of the ceramic base body.
 11. A method of fabricating anelectrical component comprising: forming a ceramic base body comprisinga surface that is partially ceramic, the ceramic base body comprisingelectrodes in an interior of the ceramic base body, the electrodescomprising ends that form parts of the surface; and applying a bondinglayer to the surface of the ceramic base body, the bonding layer bondingless to the ends of the electrodes than to ceramic parts of the surface.12. The method claim 11, further comprising: applying a contact body tothe bonding layer; heating the electrical component during a thermalfixing phase so that the bonding layer is removed from the parts of thesurface formed by the electrode ends and so that a contact comprised ofends of electrodes is formed to the contact body.
 13. The method ofclaim 11, wherein the bonding layer comprises a lead-borosilicatemixture.
 14. The method of claim 11, wherein the bonding layer comprisesglass.
 15. The method of claim 11, wherein the bonding layer comprisesone or more of the following materials: Ba, Al, Cu, Fe, Cr, and Mg. 16.The method of claim 11, wherein the ceramic base body is formed viamultilayer technology.
 17. The method of claim 11, further comprising:forming contact bodies that make electrical contact with ends ofelectrodes at the surface of the ceramic base body, the contact bodescomprising a base metallization comprising silver (Ag).
 18. The methodof claim 17, wherein the silver is reinforced galvanically with nickeland tin.
 19. An electrical component comprising: a base body comprisingceramic and electrodes among the ceramic, the electrodes having endsthat reach a surface of the base body; at least one contact body; and abonding layer between the base body and the at least one contact body,the bonding layer bonding to the at least one contact body and to partsof the surface of the base body that do not include the electrode ends.20. The electrical component of claim 19, wherein the contact body andat least some of the ends of the electrodes are electrically connected.